UNIQUE Fabricaiton Capability

26 Layers with back drill

Material:FR-4 TG180
Tolerance:± 3mil
HL Strength:Through desmear clear to make sure no remain copper in hole wall. It could helps signal transfer stable. HL can do different level back drill on one board

Gold finger without conducting wire

Strength:Gold finger gap comply with international specification : 4mil+/-2mil, Can prevent IC damage

Embeded Copper coin 
Stength: Heat dissipation for your IC,

copper smooth,to prevent solder empty.

Half-hole process 
Strength:

Copper smooth,to prevent fur and peeling

Heavy Copper Borard
Strength:

5 oz copper,surface smooth, copper plated evenly 

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Blind Routing
Strength:

CNC blind routing